Industry Applications
Diamond & CBN Tooling for Semiconductor and Electronics Manufacturing
Wafer back-grinding, dicing, optical connector finishing and precision component machining demand tooling that holds tolerance at micron level and never contaminates the workpiece.
Request a QuoteWhat makes this industry demanding
- Wafer dicing and back-grinding must avoid micro-cracking, edge chipping and metal contamination.
- Optical fibre connectors and photonic components need mirror-grade finishes at sub-micron Ra.
- Aluminium and copper heat-management parts require clean cutting without built-up edge.
- Tool wear must be predictable so process windows stay stable across long production runs.
How CDFIT solves it
CDFIT supplies ultra-thin diamond dicing blades, fine-grit diamond lapping film and vitrified-bond diamond cup wheels engineered for brittle, high-value substrates. Every grade is selected so cut quality, subsurface damage and tool life stay consistent lot to lot.
Recommended products
Ultra-Thin Diamond Saw Blade 0.1-0.6 mm for Gem, Jade and Semiconductor
View product →
Diamond Polishing Film for Fiber Optic Connector (30/15/9/3/1 um)
View product →
Vitrified Bond Diamond Cup Grinding Wheel for Aluminum (60#-50000#)
View product →What you gain
Consistent Sub-Surface Quality
Controlled diamond size distribution and bond hardness keep micro-crack depth and Ra within your process window.
Contamination-Free
Bond systems and processing selected for low metallic residue on sensitive wafers and optics.
Engineering Support
Send your substrate, target Ra and machine data — our engineers specify the grade, not just a catalogue part number.
Ready to specify the right tool?
Discuss your wafer or optical application with our engineers.
Start an Inquiry